Distributors: Contact SPI Technologies 3D PLUS is the leading company for the 3-D electronics packaging in Europe and is recognized as a high performance innovator in the design and manufacturing of miniaturized 3-D modules for Active, Passive, Opto-electronics and MEMS/MOEMS components packaging. 3D PLUS provides innovative solutions for high technology sectors in the commercial, industrial, military, medical and space markets. The technique of interconnection in 3 dimensions of all types of components was set up at Thomson-CSF as of 1989. Comparing to other existing 2-D traditional solutions, this technology allows gaining a factor of at least 10 on the weight and volume of the components. In 1996, Pierre Maurice and Christian Val, who designed this technology, bought the 3D technology patents and launched 3Dplus Company in order to manufacture cubes based on this principle and patented portfolio. 3Dplus is the only one in Europe to specialize in this technology. Sustained R&D activities and Innovations allow to extend and patent the 3-D technology capability domain and product range. The latest technology was developed by 3Dplus in the field of 3-D opto electronics and on 3-D silicon wafer stacking. In 2001, 3Dplus set up a subsidiary in Mc Kinney, Texas, USA. In 2002, 3Dplus built a new manufacturing plant in Buc, France for medium series manufacturing. The company is now 7 years old and its growth rate is 100% per year. 3Dplus production Line was successfully evaluated and qualified by CNES, ESA and NASA in 2001. | 
